The company's stock surged over 8% after its major customer, Taiwan Semiconductor Manufacturing (TSMC), announced a significant increase in capital spending plans and a strong revenue growth forecast for 2026. This news lifted the entire chip equipment sector. The company is also aiming to double its High Bandwidth Memory (HBM) business revenue from $1.5 billion to $3 billion, leveraging its hybrid bonding technology and Kinex system to meet rising AI-driven demand.